Patent Assignment
Reel/Frame 052932/0028
Assignment of Assignor's Interest
Recorded: 2020-06-12
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-05-13
LAI, CHI-HUI
Executed: 2020-05-13
KUO, TIN-HAO
Executed: 2020-05-13
TSAI, HAO-YI
Executed: 2020-05-13
LIU, CHUNG-SHI
Executed: 2020-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method