Patent Assignment
Reel/Frame 052934/0272
Assignment of Assignor's Interest
Recorded: 2020-06-14
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Manufacturing Method of Image Sensor Device Having Metal Grid Partially Embedded in Buffer Layer