Patent Assignment
Reel/Frame 052934/0283
Assignment of Assignor's Interest
Recorded: 2020-06-14
Pages: 4
Assignors
CHANG, KUANG-HUNG
Executed: 2020-05-12
HOU, YUAN-TE
Executed: 2020-05-12
WANG, CHUNG-HSING
Executed: 2020-05-12
HOU, YUNG-CHIN
Executed: 2020-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit with Thicker Metal Lines on Lower Metallization Layer
Patent:
11,113,443 →
Application:
16/900,684 →