Patent Assignment
Reel/Frame 052944/0453
Assignment of Assignor's Interest
Recorded: 2020-06-15
Pages: 5
Assignors
KUAH, TENG HOCK
Executed: 2020-06-08
LIN, YI
Executed: 2020-06-05
YAN, KAR WENG
Executed: 2020-06-05
ANGELITO BARROZO, PEREZ
Executed: 2020-06-05
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Dual-Sided Molding for Encapsulating Electronic Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.