Patent Assignment
Reel/Frame 052944/0797
Assignment of Assignor's Interest
Recorded: 2020-06-15
Pages: 6
Assignors
TENG, PO-YUAN
Executed: 2020-05-22
TSAI, HAO-YI
Executed: 2020-05-22
PAN, KUO-LUNG
Executed: 2020-05-22
HSU, SEN-KUEI
Executed: 2020-05-22
KUO, TIN-HAO
Executed: 2020-05-22
LEI, YI-YANG
Executed: 2020-05-22
TSENG, YING-CHENG
Executed: 2020-05-22
LAI, CHI-HUI
Executed: 2020-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method of Package Structure Thereof