Patent Assignment
Reel/Frame 052952/0445
Assignment of Assignor's Interest
Recorded: 2020-06-16
Pages: 6
Assignors
CHOI, JAYBOK
Executed: 2020-03-26
AHN, YONGSEOK
Executed: 2020-03-26
LEE, SEUNGHYUNG
Executed: 2020-03-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Manufacturing Method Thereof