Patent Assignment
Reel/Frame 052979/0628
Assignment of Assignor's Interest
Recorded: 2020-06-18
Pages: 7
Assignors
KO, JUNGMIN
Executed: 2020-06-04
KANG, HYEONGMUN
Executed: 2020-06-04
PARK, SANGSICK
Executed: 2020-06-04
SONG, HYEONJUN
Executed: 2020-06-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Chip End Design and Trenches to Control Fillet Spreading in Stacked Chip Packages