Patent Assignment
Reel/Frame 052983/0367
Assignment of Assignor's Interest
Recorded: 2020-06-18
Pages: 10
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Recording Medium, and Method of Processing Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.