Patent Assignment
Reel/Frame 052984/0550
Assignment of Assignor's Interest
Recorded: 2020-06-19
Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2020-05-28
CHEN, HSIEN-WEI
Executed: 2020-05-28
CHEN, MING-FA
Executed: 2020-05-29
YEH, SUNG-FENG
Executed: 2020-05-28
LIU, TZUAN-HORNG
Executed: 2020-05-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die Stack Structure and Manufacturing Method Thereof