Patent Assignment
Reel/Frame 052991/0978
Assignment of Assignor's Interest
Recorded: 2020-06-19
Pages: 3
Assignor
UMETANI, HIROSHI
Executed: 2020-06-08
Assignee
SEKISUI POLYMATECH CO., LTD.
8-10-1, TAJIMA, SAKURA-KU, SAITAMA-CITY, SAITAMA, 338-0837, JAPAN
Covered Property
(1)
Thermally Conductive Composition and Thermally Conductive Molded Body