IP Library Assignment 053001/0777
Patent Assignment
Reel/Frame 053001/0777

Assignment of Assignor's Interest

Recorded: 2020-06-22 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2020-06-08
MIRKARIMI, LAURA WILLS
Executed: 2020-06-08
Assignee
INVENSAS BONDING TECHONOLGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assembly from Processed Substrate
Application: 16/842,233 →
Publication: US 2020/0243380
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name May 9, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 063589/0202 →