IP Library › Assignment 063589/0202
Patent Assignment
Reel/Frame 063589/0202

Change of Name

Recorded: 2023-05-09 Pages: 5
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (11)
Microelectronic Assembly from Processed Substrate
Application: 16/842,233 →
Publication: US 2020/0243380
Techniques for Processing Devices
Application: 16/919,989 →
Publication: US 2020/0365575
Reliable Hybrid Bonded Apparatus
Application: 17/208,695 →
Publication: US 2021/0305202
Dbi to Si Bonding for Simplified Handle Wafer
Application: 17/209,638 →
Publication: US 2021/0233889
Die Processing
Application: 17/231,965 →
Publication: US 2021/0233888
Techniques for Processing Devices
Application: 17/344,100 →
Publication: US 2021/0375850
Direct Bonding Methods and Structures
Application: 17/452,753 →
Publication: US 2022/0139867
Direct Bonding Methods and Structures
Application: 17/452,754 →
Publication: US 2022/0139869
Microelectronic Assembly from Processed Substrate
Application: 17/825,405 →
Publication: US 2022/0285213
Direct Bonding Methods and Structures
Application: 63/107,228 →
Direct Bonding Methods and Structures
Application: 63/107,280 →
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Jun 22, 2020
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 053001/0777 →
Assignment of Assignor's Interest Sep 22, 2020
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS; GAO, GUILIAN; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 053849/0331 →
Assignment of Assignor's Interest Nov 4, 2020
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 054273/0432 →
Assignment of Assignor's Interest Nov 24, 2020
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 054457/0235 →
Assignment of Assignor's Interest Apr 9, 2021
From: UZOH, CYPRIAN EMEKA; MROZEK, PAWEL
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 055880/0118 →
Assignment of Assignor's Interest Apr 15, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 055936/0198 →
Assignment of Assignor's Interest Oct 12, 2021
From: MANDALAPU, CHANDRASEKHAR; FOUNTAIN, GAIUS GILLMAN, JR.; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 057765/0742 →
Assignment of Assignor's Interest Dec 29, 2021
From: UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 058503/0573 →
Assignment of Assignor's Interest Jan 12, 2022
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 058635/0573 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest May 17, 2023
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS; GAO, GUILIAN; FOUNTAIN, GAIUS GILLMAN, JR
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 063677/0548 →
Assignment of Assignor's Interest May 18, 2023
From: UZOH, CYPRIAN EMEKA; MIRKARIMI, LAURA WILLS
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 063689/0177 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →