Patent Assignment
Reel/Frame 058503/0573
Assignment of Assignor's Interest
Recorded: 2021-12-29
Pages: 3
Assignor
UZOH, CYPRIAN EMEKA
Executed: 2021-12-14
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Bonding Methods and Structures
Patent:
12,424,584 →
Application:
17/452,753 →
Publication:
US 2022/0139867
PCT:
PCT/US2021/072096 ↗
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 9, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 063589/0202 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →