Patent Assignment
Reel/Frame 057765/0742
Assignment of Assignor's Interest
Recorded: 2021-10-12
Pages: 3
Assignors
MANDALAPU, CHANDRASEKHAR
Executed: 2021-09-17
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2021-08-09
GAO, GUILIAN
Executed: 2021-09-16
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Dbi to Si Bonding for Simplified Handle Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 9, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 063589/0202 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →