DBI to SI bonding for simplified handle wafer
Devices and techniques include process steps for preparing various microelectronic components for bonding, such as for direct bonding without adhesive. The processes include providing a first bonding surface on a first surface of the microelectronic components, bonding a handle to the prepared first bonding surface, and processing a second surface of the microelectronic components while the microelectronic components are gripped at the handle. In some embodiments, the processes include removing the handle from the first bonding surface, and directly bonding the microelectronic components at the first bonding surface to other microelectronic components.
1. A method comprising:
preparing a bonding surface of a substrate;
direct bonding a first surface of each of a plurality of microelectronic components to the bonding surface using a direct dielectric-to-dielectric, non-adhesive technique to form at least a portion of a structure;
while the substrate supports the plurality of microelectronic components, processing a second surface of each of the plurality of microelectronic components, wherein the second surface is opposite the first surface;
after processing the second surface of each of the plurality of microelectronic components, removing the substrate by grinding or polishing the substrate; and
after removing the substrate, singulating the structure to form a plurality of microelectronic units, wherein each of the plurality of microelectronic units comprises at least one of the plurality of microelectronic components.
2. The method of claim 1 , further comprising:
before singulating the structure, applying a coating to surfaces of the plurality of microelectronic components exposed by grinding or polishing the substrate.
3. The method of claim 1 , wherein processing the second surface of each of the plurality of microelectronic components comprises thinning each of the plurality of microelectronic components to less than 20 microns while the plurality of microelectronic components is bonded to the substrate.
4. The method of claim 1 , further comprising plasma activating the bonding surface of the substrate.
5. The method of claim 1 , wherein processing the second surface of each of the plurality microelectronic components comprises planarizing the second surface of each of the plurality of microelectronic components to form second bonding surfaces.
6. The method of claim 1 , wherein the first surface of each of the plurality of microelectronic components comprises an oxide and includes one or more conductive interconnects.
7. The method of claim 1 , wherein the substrate comprises an oxide.
8. The method of claim 1 , wherein the substrate comprises silicon.
9. The method of claim 8 , wherein the substrate comprises an oxide layer of less than 10 nm formed on the silicon and wherein the oxide layer at least partially defines the bonding surface.
10. The method of claim 9 , wherein the oxide layer is formed on the silicon by thermal oxidation.
11. A method comprising:
direct bonding a plurality of microelectronic components to a substrate using a permanent direct dielectric-to-dielectric, non-adhesive technique, wherein the plurality of microelectronic components comprises a first microelectronic component substrate;
while the substrate supports the plurality of microelectronic components, planarizing a first surface of each of the plurality of microelectronic components and providing a bonding layer on the first surfaces, wherein the first surfaces face away from the substrate;
removing the substrate; and
direct bonding a second microelectronic component to the bonding layer on the first microelectronic component using a direct bonding technique without an adhesive, wherein the bonding layer on the first microelectronic component comprises a first conductive feature and the second microelectronic component comprises a second conductive feature directly bonded to the first conductive feature.
12. The method of claim 11 , wherein direct bonding the plurality of microelectronic components to the substrate comprises direct bonding the plurality of microelectronic components to the substrate to form at least a portion of a structure, the method further comprising singulating the structure into a plurality of microelectronic units.
13. The method of claim 12 , wherein the plurality of microelectronic units comprises a first microelectronic unit that includes the first and second microelectronic components, the method further comprising stacking and bonding the first microelectronic unit to a prepared host die, wafer, or substrate using a direct bonding technique without adhesive.
14. The method of claim 11 , further comprising, before planarizing the first surfaces of the plurality of microelectronic components, thinning the each of the plurality of microelectronic components to form the first surfaces.
15. The method of claim 11 , further comprising depositing an insulating layer at the first surfaces to form the bonding layer.
16. The method of claim 1 , wherein preparing the bonding surface of the substrate comprises planarizing the bonding surface.
17. The method of claim 1 , wherein the plurality of microelectronic components comprises a first microelectronic component, the method further comprising:
direct bonding a second microelectronic component to a bonding layer on the first microelectronic component.
18. The method of claim 17 , wherein the bonding layer on the first microelectronic component comprises a first conductive feature, wherein the second microelectronic component comprises a second conductive feature, and wherein the second conductive feature is vertically aligned with and directly bonded to the first conductive feature.
19. The method of claim 12 , further comprising:
before singulating the structure, applying a coating to a second surface of each of the plurality of microelectronic components.
20. The method of claim 11 , wherein removing the substrate comprises removing the substrate by grinding or polishing the substrate.
21. The method of claim 11 , wherein the first conductive feature is vertically aligned with the second conductive feature.
22. The method of claim 11 , wherein direct bonding the plurality of microelectronic components to the substrate using a permanent direct dielectric-to-dielectric non-adhesive technique comprises forming a permanent bond between a dielectric layer of the substrate and each of the plurality of microelectronic components, and wherein removing the substrate includes removing the dielectric layer of the substrate used to form the permanent bond.
23. The method of claim 11 , further comprising:
plasma activating at least one of the substrate and the first microelectronic component before directly bonding the plurality of microelectronic components to the substrate.
24. A method comprising:
providing a structure comprising a plurality of microelectronic components directly bonded to a substrate using a direct dielectric-to-dielectric, non-adhesive technique;
while the substrate supports the plurality of microelectronic components, processing each of the plurality of microelectronic components to form a first surface on each of the plurality of microelectronic components, wherein each of the first surfaces faces away from the substrate;
after processing each of the plurality of microelectronic components to form the first surfaces, removing the substrate to expose a second surface of each of the plurality of microelectronic components;
applying more than one type of protective coating over the second surface of each of the plurality of microelectronic components; and
after applying the more than one type of protective coatings, singulating the structure to form a plurality of microelectronic units, wherein each of the plurality of microelectronic units comprises at least one of the plurality of microelectronic components.
25. The method of claim 24 , wherein at least some of the plurality of microelectronic components comprise one or more conductive features formed at the second surface of each of the plurality of microelectronic components.
26. The method of claim 24 , further comprising, after processing each of the plurality of microelectronic components but before removing the substrate, planarizing the first surface of each of the plurality of microelectronic components.
27. The method of claim 24 , wherein processing each of the plurality of microelectronic components comprises thinning each of the plurality of microelectronic components.
28. The method of claim 24 , wherein processing each of the plurality of microelectronic components comprises planarizing each of the plurality of microelectronic components.
29. The method of claim 24 , wherein removing the substrate to expose a second surface of each of the plurality of microelectronic components comprises removing the substrate by grinding or polishing the substrate.
30. The method of claim 24 , wherein the plurality of microelectronic components comprises a first microelectronic component and wherein the plurality of microelectronic units comprises a first microelectronic unit that includes the first microelectronic unit, the method further comprising:
direct bonding a second microelectronic component to a bonding layer on the first microelectronic component.
31. The method of claim 30 , wherein the bonding layer on the first microelectronic component comprises a first conductive feature, wherein the second microelectronic component comprises a second conductive feature, and wherein the second conductive feature is vertically aligned with and directly bonded to the first conductive feature.