IP Library Assignment 063689/0177
Patent Assignment
Reel/Frame 063689/0177

Assignment of Assignor's Interest

Recorded: 2023-05-18 Pages: 3
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2020-06-08
MIRKARIMI, LAURA WILLS
Executed: 2020-06-08
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Assembly from Processed Substrate
Application: 17/825,405 →
Publication: US 2022/0285213
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name May 9, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 063589/0202 →