IP Library Assignment 053024/0384
Patent Assignment
Reel/Frame 053024/0384

Assignment of Assignor's Interest

Recorded: 2020-06-24 Pages: 4
Assignors
MOMMA, JUN
Executed: 2020-06-24
AOKI, KATSUYUKI
Executed: 2020-06-24
TAKAHASHI, SATOSHI
Executed: 2020-06-24
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI, KANAGAWA, 235-8522, JAPAN
Covered Property (1)
Sintered Body, Substrate, Circuit Board, and Manufacturing Method of Sintered Body
Application: 16/653,014 →
Publication: US 2020/0113047
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →