Patent Assignment
Reel/Frame 053026/0053
Assignment of Assignor's Interest
Recorded: 2020-06-24
Pages: 8
Assignors
WE, HONG BOK
Executed: 2020-06-08
HSU, MARCUS
Executed: 2020-06-22
PATIL, ANIKET
Executed: 2020-06-06
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Integrated Circuit (Ic) Packages Employing Split, Double-Sided Metallization Structures to Facilitate a Semiconductor Die ("Die") Module Employing Stacked Dice, and Related Fabrication Methods