Patent Assignment
Reel/Frame 053027/0152
Assignment of Assignor's Interest
Recorded: 2020-06-24
Pages: 3
Assignors
ISOZAKI, SEIYA
Executed: 2020-06-16
KOBAYASHI, TATSUYA
Executed: 2020-06-16
JINNO, KOTA
Executed: 2020-06-16
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including a Plurality of Bonding Pads