Patent Assignment
Reel/Frame 053028/0637
Assignment of Assignor's Interest
Recorded: 2020-06-24
Pages: 2
Assignor
PARK, CHUL
Executed: 2020-06-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Bonding Wire Branch Structure