Patent Assignment
Reel/Frame 053029/0157
Assignment of Assignor's Interest
Recorded: 2020-06-24
Pages: 4
Assignors
KUO, HUNG-JUI
Executed: 2020-06-16
CHANG, TAI-MIN
Executed: 2020-06-17
TSAI, HUI-JUNG
Executed: 2020-06-15
LU, DE-YUAN
Executed: 2020-06-15
LEE, MING-TAN
Executed: 2020-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages with Enlarged Through-Vias in Encapsulant