Patent Assignment
Reel/Frame 053045/0603
Assignment of Assignor's Interest
Recorded: 2020-06-26
Pages: 4
Assignors
TSAO, CHIH-CHIANG
Executed: 2020-01-14
CHIU, CHAO-WEI
Executed: 2020-01-14
KUO, HSUAN-TING
Executed: 2020-01-14
CHANG, CHIA-LUN
Executed: 2020-01-14
WONG, CHENG-SHIUAN
Executed: 2020-01-14
LIN, HSIU-JEN
Executed: 2020-01-14
HSIEH, CHING-HUA
Executed: 2020-01-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fan-Out Packages and Methods of Forming the Same