Fan-out packages and methods of forming the same
A device may include a first package and a second package where the first package has a warped shape. First connectors attached to a redistribution structure of the first package include a spacer embedded therein. Second connectors attached to the redistribution structure are fee from the spacer, the spacer of the first connectors keeping a minimum distance between the first package and the second package during attaching the first package to the second package.
1. A device comprising:
a first package, the first package comprising an embedded die and a redistribution structure, the first package having warpage;
first connectors attached to the redistribution structure, the first connectors comprising a spacer embedded in the first connectors, a first barrier layer surrounding the spacer, a conductive layer surrounding the first barrier layer, a solder material layer surrounding the conductive layer, and a second barrier layer interposed between the conductive layer and the solder material layer, the first connectors disposed at one or more center contact pads of the first package;
second connectors attached to the redistribution structure, the second connectors being free from the spacer, wherein a material of the spacer has a first reflow temperature, the second connectors have a second reflow temperature, and the first reflow temperature is greater than the second reflow temperature; and
a second package, the first connectors and the second connectors electrically and physically coupling the first package to the second package.
2. The device of claim 1 , wherein the first connectors are disposed in corners of the first package.
3. The device of claim 1 , wherein the spacer is spherical.
4. The device of claim 1 , wherein the spacer has a flat upper surface and a flat lower surface.
5. The device of claim 1 , wherein the spacer comprises a ceramic or plastic core material.
6. The device of claim 1 , wherein a first distance between a first contact pad of the first package and a second contact pad of the second package at the first connectors is less than a second distance between a third contact pad of the first package and a fourth contact pad of the second package at the second connectors, the first and third contact pads being at a same level of the first package, the second and fourth contact pads being at a same level of the second package, wherein the first distance and second distance are each measured from same respective surfaces of the first contact pad, second contact pad, third contact pad, and fourth contact pad.
7. The device of claim 1 , wherein the spacer of a first one of the first connectors physically contacts a first contact pad of the first package and a second contact pad of the second package, wherein the spacer of a second one of the first connectors is physically separated from a third contact pad of the first package and a fourth contact pad of the second package.
8. A device comprising:
a first package, the first package comprising an embedded die interposed between a redistribution structure and a package lid, the redistribution structure having first contact regions and second contact regions at a front side of the redistribution structure;
first connectors disposed over first contact regions of the first package, the first connectors each including a spacer embedded in a solder material, the spacer including a solid core, a barrier surrounding the solid core, a conductive layer surrounding the barrier, the solder material surrounding the conductive layer, and a second barrier interposed between the conductive layer and the solder material, wherein the first connectors are disposed at a middle of a row of first connectors and second connectors; and
second connectors disposed over second contact regions of the first package, the second connectors each including the solder material, the solder material having a lower reflow temperature than a reflow temperature of the spacer.
9. The device of claim 8 , wherein the solid core of the spacer is comprised of a non-conductive plastic or ceramic material.
10. The device of claim 8 , wherein an uppermost surface of the first connectors and an uppermost surface of the second connectors are not level due to warpage in the first package.
11. The device of claim 8 , wherein the spacer has flat sidewalls, the solder material protruding laterally beyond the flat sidewalls of the spacer.
12. The device of claim 8 wherein the first connectors and the second connectors each have the same size.
13. The device of claim 8 , wherein the spacer is spherical.
14. A device comprising:
a first package, the first package comprising an embedded die;
a second package, the second package electrically coupled to the first package; and
a first set of connectors interposed between the first package and the second package, the first set of connectors each comprising a spacer, a first barrier layer surrounding the spacer, a conductive layer surrounding the first barrier layer, a second barrier layer surrounding the conductive layer, and a solder material layer surrounding the second barrier layer, wherein in a first connector of the first set of connectors the spacer contacts the first package or the second package.
15. The device of claim 14 , wherein in the first connector the spacer contacts both the first package and the second package.
16. The device of claim 15 , wherein in a second connector of the first set of connectors the spacer is physically separated from both the first package and the second package.
17. The device of claim 14 , wherein a distance between the first package and the second package at a center of the first package is a first distance, wherein a distance between the first package and the second package at a corner of the first package is a second distance different than the first distance, wherein the first distance and the second distance are each greater than or equal to a height of the spacer of the first set of connectors, wherein the first distance is a different value than the second distance.
18. The device of claim 14 , wherein the spacer has a higher melting point than the solder material layer.
19. The device of claim 14 , wherein the first set of connectors each further comprises a doped solder layer surrounding the solder material layer.
20. The device of claim 19 , wherein the first set of connectors each further comprises a second barrier layer surrounding the conductive layer, wherein the solder material layer surrounds the second barrier layer.