Patent Assignment
Reel/Frame 053045/0773
Assignment of Assignor's Interest
Recorded: 2020-06-26
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2020-06-15
WONG, TECHI
Executed: 2020-06-09
CHUANG, PO-YAO
Executed: 2020-06-09
CHEN, SHUO-MAO
Executed: 2020-06-10
CHOU, MENG-WEI
Executed: 2020-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming Same