Patent Assignment
Reel/Frame 053072/0774
Assignment of Assignor's Interest
Recorded: 2020-06-29
Pages: 10
Assignors
LIN, KEVIN L.
Executed: 2020-06-24
YEMENICIOGLU, SUKRU
Executed: 2020-06-25
MORROW, PATRICK
Executed: 2020-06-26
SCHENKER, RICHARD
Executed: 2020-06-24
KOBRINSKY, MAURO
Executed: 2020-06-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Vertically Spaced Intra-Level Interconnect Line Metallization for Integrated Circuit Devices