Patent Assignment
Reel/Frame 053074/0602
Assignment of Assignor's Interest
Recorded: 2020-06-29
Pages: 5
Assignors
OSADA, SHOICHI
Executed: 2020-06-04
OISHI, HIROKI
Executed: 2020-06-04
KAWAMURA, NORIFUMI
Executed: 2020-06-04
HAGIWARA, KENJI
Executed: 2020-06-04
YOKOTA, RYUHEI
Executed: 2020-06-04
KANETA, MASAHIRO
Executed: 2020-06-04
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device