Patent Assignment
Reel/Frame 053079/0542
Assignment of Assignor's Interest
Recorded: 2020-06-29
Pages: 4
Assignors
TSENG, YING-CHENG
Executed: 2020-06-02
TSAI, HAO-YI
Executed: 2020-06-01
HUANG, YU-CHIH
Executed: 2020-06-01
LIU, CHIA-HUNG
Executed: 2020-06-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of Semiconductor Package