Patent Assignment
Reel/Frame 053091/0259
Assignment of Assignor's Interest
Recorded: 2020-06-30
Pages: 6
Assignors
WAGATSUMA, YUICHIRO
Executed: 2020-06-11
ASAKURA, KENTARO
Executed: 2020-06-12
SAITOU, TETSUYA
Executed: 2020-06-12
WATANABE, MASAHISA
Executed: 2020-06-11
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Delivery Method