Patent Assignment
Reel/Frame 053102/0386
Assignment of Assignor's Interest
Recorded: 2020-07-01
Pages: 4
Assignors
LIN, YAOJIAN
Executed: 2014-12-03
BAO, XU SHENG
Executed: 2014-12-03
CHEN, KANG
Executed: 2014-12-03
Assignee
STATS CHIPPAC PTE. LTD., FORMERLY STATS CHIPPAC, LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device having an Embedded Conductive Layer for Power/Ground Planes in FO-EWLB