Patent Assignment
Reel/Frame 053106/0938
Assignment of Assignor's Interest
Recorded: 2020-07-02
Pages: 2
Assignors
CHEN, WEIMING CHRIS
Executed: 2020-06-10
TING, KUO-CHIANG
Executed: 2020-06-09
HOU, SHANG-YUN
Executed: 2020-06-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip-On-Wafer Structure with Chiplet Interposer