Patent Assignment
Reel/Frame 053114/0706
Assignment of Assignor's Interest
Recorded: 2020-07-03
Pages: 4
Assignors
HUANG, KUAN-YU
Executed: 2020-06-11
HUANG, SUNG-HUI
Executed: 2020-06-11
HOU, SHANG-YUN
Executed: 2020-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Fabricating Method Thereof