Patent Assignment
Reel/Frame 053115/0331
Assignment of Assignor's Interest
Recorded: 2020-07-03
Pages: 7
Assignors
LIU, FU-CHOU
Executed: 2020-06-30
HSU, JUI-HUNG
Executed: 2020-06-30
PENG, YU-CHIANG
Executed: 2020-06-30
LEE, CHIEN-CHEN
Executed: 2020-05-25
CHANG, YA-HAN
Executed: 2020-06-30
HUNG, LI-CHUN
Executed: 2020-06-05
Assignee
KINGPAK TECHNOLOGY INC.
NO.84, TAI-HO RD., CHU-PEI,, HSIN-CHU COUNTY, 302, TAIWAN
Covered Property
(1)
Sensor Package Structure with Ring-Shaped Solder Mask Frame
Application:
16/920,492 →
Publication:
US 2021/0305437
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.