IP Library › Assignment 053125/0221
Patent Assignment
Reel/Frame 053125/0221

Assignment of Assignor's Interest

Recorded: 2020-07-06 Pages: 3
Assignor
HSIEH, YU-TE
Executed: 2018-08-14
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Multi-Chip Packaging Structure for an Image Sensor
Application: 16/946,768 →
Publication: US 2020/0335544
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 25, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054523/0378 →
Release of Security Interest in Patents Previously Recorded at Reel 054523, Frame 0378 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0602 →