Patent Assignment
Reel/Frame 053125/0665
Assignment of Assignor's Interest
Recorded: 2020-07-06
Pages: 4
Assignor
KIM, YOUNGLYONG
Executed: 2020-06-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Dummy Chip on a First Semiconductor Chip and Laterally Spaced Apart from a Second Semiconductor Chip