Patent Assignment
Reel/Frame 053128/0794
Assignment of Assignor's Interest
Recorded: 2020-07-06
Pages: 3
Assignors
CHOU, HSU-FENG
Executed: 2020-07-01
NELLIS, KEITH
Executed: 2020-06-30
NGUYEN, LOI
Executed: 2020-06-30
Assignee
INPHI CORPORATION
2953 BUNKER HILL LANE, SUITE 300, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method of Manufacturing and Packaging Silicon Photonics Integrated Circuit Dies in Wafer Form
Patent:
11,837,509 →
Application:
16/920,069 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest
Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest
Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →