Patent Assignment
Reel/Frame 053130/0165
Assignment of Assignor's Interest
Recorded: 2020-07-07
Pages: 4
Assignors
KUO, HUNG-JUI
Executed: 2020-04-17
TSAI, HUI-JUNG
Executed: 2020-04-17
CHANG, TAI-MIN
Executed: 2020-06-17
WANG, CHIA-WEI
Executed: 2020-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Taper-Shaped Conductive Pillar and Method of Forming Thereof