IP Library Assignment 053143/0978
Patent Assignment
Reel/Frame 053143/0978

Assignment of Assignor's Interest

Recorded: 2020-07-08 Pages: 10
Assignors
ELLIOT, ALFRED GRANT
Executed: 2015-04-20
ELLIOT, BRENT
Executed: 2015-04-20
BALMA, FRANK
Executed: 2015-04-20
SCHUSTER, RICHARD
Executed: 2015-04-20
REX, DENNIS GEORGE
Executed: 2015-04-14
VEYTSER, ALEXANDER
Executed: 2015-04-20
Assignee
COMPONENT RE-ENGINEERING COMPANY, INC.
4151 BURTON DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
Application: 16/406,543 →
Publication: US 2020/0031725
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 054079/0270 →
Patent Security Agreement (Short Form) Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →