IP Library › Assignment 054079/0270
Patent Assignment
Reel/Frame 054079/0270

Assignment of Assignor's Interest

Recorded: 2020-10-16 Pages: 9
Assignor
Assignee
WATLOW ELECTRIC MANUFACTURING COMPANY
12001 LACKLAND ROAD, ST. LOUIS, MISSOURI, 63146
Covered Properties (2)
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
Application: 15/341,843 →
Publication: US 2017/0263486
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
Application: 16/406,543 →
Publication: US 2020/0031725
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 5, 2020
From: STEPHENS, JASON
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0569 →
Assignment of Assignor's Interest Feb 5, 2020
From: PARKER, MICHAEL
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0571 →
Assignment of Assignor's Interest Feb 5, 2020
From: ELLIOT, BRENT DONALD ALFRED
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0542 →
Assignment of Assignor's Interest Feb 5, 2020
From: BALMA, FRANK
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0547 →
Assignment of Assignor's Interest Feb 5, 2020
From: HUSSEN, GULEID
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0567 →
Assignment of Assignor's Interest Jul 8, 2020
From: ELLIOT, ALFRED GRANT; ELLIOT, BRENT; BALMA, FRANK; SCHUSTER, RICHARD
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 053143/0978 →
Assignment of Assignor's Interest Sep 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 053791/0283 →
Patent Security Agreement (Short Form) Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →