IP Library Assignment 051732/0567
Patent Assignment
Reel/Frame 051732/0567

Assignment of Assignor's Interest

Recorded: 2020-02-05 Pages: 2
Assignor
HUSSEN, GULEID
Executed: 2020-01-09
Assignee
COMPONENT RE-ENGINEERING COMPANY, INC.
3508 BASSETT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
Application: 15/341,843 →
Publication: US 2017/0263486
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 5, 2020
From: BALMA, FRANK
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0547 →
Assignment of Assignor's Interest Feb 5, 2020
From: ELLIOT, BRENT DONALD ALFRED
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0542 →
Assignment of Assignor's Interest Feb 5, 2020
From: STEPHENS, JASON
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0569 →
Assignment of Assignor's Interest Feb 5, 2020
From: PARKER, MICHAEL
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0571 →
Assignment of Assignor's Interest Sep 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 053791/0283 →
Assignment of Assignor's Interest Oct 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 054079/0270 →
Patent Security Agreement (Short Form) Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →