Patent Assignment
Reel/Frame 051732/0569
Assignment of Assignor's Interest
Recorded: 2020-02-05
Pages: 2
Assignor
STEPHENS, JASON
Executed: 2020-01-13
Assignee
COMPONENT RE-ENGINEERING COMPANY, INC.
3508 BASSETT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 2020
From: BALMA, FRANK
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0547 →
Assignment of Assignor's Interest
Feb 5, 2020
From: ELLIOT, BRENT DONALD ALFRED
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0542 →
Assignment of Assignor's Interest
Feb 5, 2020
From: HUSSEN, GULEID
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0567 →
Assignment of Assignor's Interest
Feb 5, 2020
From: PARKER, MICHAEL
To: COMPONENT RE-ENGINEERING COMPANY, INC.
Reel/Frame 051732/0571 →
Assignment of Assignor's Interest
Sep 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 053791/0283 →
Assignment of Assignor's Interest
Oct 16, 2020
From: COMPONENT RE-ENGINEERING COMPANY, INC.
To: WATLOW ELECTRIC MANUFACTURING COMPANY
Reel/Frame 054079/0270 →
Patent Security Agreement (Short Form)
Mar 3, 2021
From: WATLOW ELECTRIC MANUFACTURING COMPANY
To: BANK OF MONTREAL, AS ADMINISTRATIVE AGENT
Reel/Frame 055479/0708 →