Patent Assignment
Reel/Frame 053146/0769
Assignment of Assignor's Interest
Recorded: 2020-07-08
Pages: 4
Assignors
FENG, QUNCHAO
Executed: 2020-06-05
NIU, YANKUI
Executed: 2020-06-05
LIU, JINGLONG
Executed: 2020-06-05
SONG, YONGFENG
Executed: 2020-06-05
WANG, JIANGBO
Executed: 2020-06-05
WANG, JINTAO
Executed: 2020-06-05
Assignee
SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
ROOM 301, NO.2537, JINKE ROAD, ZHANGJIANG HI-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property
(1)
Multi-Die and Multi-Core Computing Platform and Booting Method for the Same