Patent Assignment
Reel/Frame 053160/0429
Assignment of Assignor's Interest
Recorded: 2020-07-09
Pages: 5
Assignor
ISHIZAKA, TADAHIRO
Executed: 2020-07-01
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Ruthenium Film Forming Method and Substrate Processing System