Patent Assignment
Reel/Frame 053161/0574
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2013-02-26
Assignee
STATS CHIPPAC PTE. LTD. FORMERLY STATS CHIPPAC, LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application Processor and Memory Integration