IP Library › Assignment 053163/0511
Patent Assignment
Reel/Frame 053163/0511

Assignment of Assignor's Interest

Recorded: 2020-07-09 Pages: 3
Assignors
STEINHAEUSSER, UTE
Executed: 2020-07-08
KONOPKA, NIKLAAS
Executed: 2020-07-09
LANDEL, ALEXANDER
Executed: 2020-07-09
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Variation of Metal Layer Stack Under Under Bump Metallization (Ubm)
Application: 16/854,769 →
Publication: US 2021/0143790
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee Name from Qualcomm Incorporated to RF360 Europe Gmbh Previously Recorded on Reel 053163 Frame 0511. Assignor(S) Hereby Confirms the Correct Assignee Name Is RF360 Europe Gmbh. Jul 10, 2020
From: STEINHAEUSSER, UTE; KONOPKA, NIKLAAS; LANDEL, ALEXANDER
To: RF360 EUROPE GMBH
Reel/Frame 053181/0589 →
Assignment of Assignor's Interest Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
Change of Owner's Address Nov 22, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 069761/0931 →