Patent Assignment
Reel/Frame 053181/0589
Corrective Assignment to Correct the Assignee Name from Qualcomm Incorporated to RF360 Europe Gmbh Previously Recorded on Reel 053163 Frame 0511. Assignor(S) Hereby Confirms the Correct Assignee Name Is RF360 Europe Gmbh.
Recorded: 2020-07-10
Pages: 5
Assignors
STEINHAEUSSER, UTE
Executed: 2020-07-08
KONOPKA, NIKLAAS
Executed: 2020-07-09
LANDEL, ALEXANDER
Executed: 2020-07-09
Assignee
RF360 EUROPE GMBH
ANZINGER STR. 13, MUNICH, 81671, GERMANY
Covered Property
(1)
Variation of Metal Layer Stack Under Under Bump Metallization (Ubm)
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 9, 2020
From: STEINHAEUSSER, UTE; KONOPKA, NIKLAAS; LANDEL, ALEXANDER
To: QUALCOMM INCORPORATED
Reel/Frame 053163/0511 →
Assignment of Assignor's Interest
Mar 16, 2023
From: RF360 EUROPE GMBH
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 063272/0475 →
Change of Owner's Address
Nov 22, 2024
From: RF360 SINGAPORE PTE. LTD.
To: RF360 SINGAPORE PTE. LTD.
Reel/Frame 069761/0931 →