Patent Assignment
Reel/Frame 053164/0725
Assignment of Assignor's Interest
Recorded: 2020-07-09
Pages: 2
Assignor
PARK, JEONG HYUN
Executed: 2020-06-30
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrate Having Power Trace Pattern and Ground Trace Pattern, and Semiconductor Package Including the Same