Patent Assignment
Reel/Frame 053166/0207
Assignment of Assignor's Interest
Recorded: 2020-07-09
Pages: 3
Assignor
IP, NATHAN
Executed: 2020-07-09
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Apparatus and Methods for Wafer to Wafer Bonding