Patent Assignment
Reel/Frame 053167/0671
Assignment of Assignor's Interest
Recorded: 2020-07-09
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2020-06-19
KUO, HUNG-YI
Executed: 2020-06-19
LIU, CHUNG-SHI
Executed: 2020-06-22
TSAI, HAO-YI
Executed: 2020-06-19
HSIEH, CHENG-CHIEH
Executed: 2020-06-22
YU, TSUNG-YUAN
Executed: 2020-06-29
TSENG, MING HUNG
Executed: 2020-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die Stacking Structure and Method Forming Same