IP Library Assignment 053170/0373
Patent Assignment
Reel/Frame 053170/0373

Change of Name

Recorded: 2020-05-29 Pages: 6
Assignor
Assignee
SHEN ZHEN TOP-LINK TECHNOLOGIES CO.,LTD
B1(1ST-4TH FLOOR)&B2(2ND FLOOR), XINHAO FIRST INDUSTRIAL ZONE, QIAOTOU COMMUNITY, FUHAI STREET, BAO'AN, SHENZHEN, CHINA
Covered Property (1)
Mains Power Wire Connection Assembly and Connection Method
Patent: 9,577,353 →
Application: 14/404,830 →
Publication: US 2015/0090492
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2014
From: SHI, JINBAO
To: SHENZHEN TOP-LINK ELECTRONICS CO., LTD
Reel/Frame 034501/0299 →