Patent Assignment
Reel/Frame 053177/0194
Assignment of Assignor's Interest
Recorded: 2020-07-10
Pages: 3
Assignor
FUNG, KA-HING
Executed: 2020-05-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same